JPH087628Y2 - 金属マスク押圧装置 - Google Patents

金属マスク押圧装置

Info

Publication number
JPH087628Y2
JPH087628Y2 JP4472790U JP4472790U JPH087628Y2 JP H087628 Y2 JPH087628 Y2 JP H087628Y2 JP 4472790 U JP4472790 U JP 4472790U JP 4472790 U JP4472790 U JP 4472790U JP H087628 Y2 JPH087628 Y2 JP H087628Y2
Authority
JP
Japan
Prior art keywords
metal mask
chip
semiconductor wafer
pressing device
solder particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP4472790U
Other languages
English (en)
Japanese (ja)
Other versions
JPH044742U (en]
Inventor
博 大久保
博 小島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP4472790U priority Critical patent/JPH087628Y2/ja
Publication of JPH044742U publication Critical patent/JPH044742U/ja
Application granted granted Critical
Publication of JPH087628Y2 publication Critical patent/JPH087628Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11005—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for aligning the bump connector, e.g. marks, spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/742—Apparatus for manufacturing bump connectors

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP4472790U 1990-04-26 1990-04-26 金属マスク押圧装置 Expired - Lifetime JPH087628Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4472790U JPH087628Y2 (ja) 1990-04-26 1990-04-26 金属マスク押圧装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4472790U JPH087628Y2 (ja) 1990-04-26 1990-04-26 金属マスク押圧装置

Publications (2)

Publication Number Publication Date
JPH044742U JPH044742U (en]) 1992-01-16
JPH087628Y2 true JPH087628Y2 (ja) 1996-03-04

Family

ID=31558284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4472790U Expired - Lifetime JPH087628Y2 (ja) 1990-04-26 1990-04-26 金属マスク押圧装置

Country Status (1)

Country Link
JP (1) JPH087628Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY130223A (en) * 1996-08-27 2007-06-29 Nippon Steel Corp Semiconductor device provided with low melting point metal bumps and process for producing same

Also Published As

Publication number Publication date
JPH044742U (en]) 1992-01-16

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term